美國UDM濃縮晶圓切削液

美國UDM AKLC300系列濃縮晶圓切削液

l          AKLC300洗滌劑濃縮液是一種可生物降解、水性、非堿性、非酸性物質(zhì)

l          PV wafer Cleaning after wafering

用于切片之后對光伏硅片進行清洗

l          DI /RO water: Detergent dilution ratio – 1000:1  to  500 :1

去離子水/反滲透水:洗滌劑溶液比例 – 1000:1至500:1

l          Application temperature:  45°C - 70°C

使用溫度：45°C - 70°C

l          Excellent wetting, cleaning and rinsing properties 

極好的濕潤、清潔和沖洗功能

l          Water surface tension reducer

降低去離子水/反滲透水表面張力

l          Completely cleans out  SiC (silicon carbide) dust and other contaminants on wafer surfaces

可以徹底清潔硅片表面的碳化硅(SiC)塵埃以及其他臟污

l         Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.

 在切片以及去膠工序之后徹底清除光伏硅片表面的銅和鐵

l          Biodegradable, non-hazardous and hence easily disposable 

可生物降解、無危害，可以很容易進行處置

l         Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)

生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L)

l          Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)

化學(xué)需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L)

聯(lián)系人：陳先生

手機：13602588976